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Semiconductor device
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#	Item
881	3D IC WORKING GROUP MEETING OCTOBER 22, 2014 3D IC Working Group Meeting Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:12:03 Three-dimensional integrated circuit Technology Deep reactive-ion etching Semiconductor device fabrication Microtechnology Materials science
882	HC19AMTutorial.peter_alfke.print.v2.ppt Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-27 23:57:31 Xilinx Field-programmable gate array Altera Transistor count Complex programmable logic device PowerPC Application-specific integrated circuit Actel Microprocessor Electronic engineering Fabless semiconductor companies Electronics
883	High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market Russell Shumway Director- MEMS & Sensor Products Office: Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:45:23 Semiconductor device fabrication Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Wafer bonding Flip chip Deep reactive-ion etching Amkor Technology Materials science Technology Microtechnology
884	Global Semiconductor Alliance Electrostatic Discharge (ESD) in 3D-IC Packages Version 1.0 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:21:51 Electrical breakdown Electrical safety Semiconductor device fabrication Electrostatics Electrostatic discharge Human-body model Three-dimensional integrated circuit Transmission-line pulse Through-silicon via Electromagnetism Integrated circuits Physics
885	3D-IC PACKAGING January 2015 3D-IC Leadership Team  Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-12-29 12:50:47 Fabless semiconductor companies Integrated circuits IMEC Leuven Three-dimensional integrated circuit Open-Silicon Xilinx TSMC Amkor Technology Semiconductor device fabrication Electronic engineering Electronics
886	SEMI® International Standards Information on 3DS-IC Activities January 2014 SEMI 3DS-IC Standards Activities Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-02-04 09:46:57 Technology Three-dimensional integrated circuit Wafer Applied Materials SUSS MicroTec Metrology 3DS Through-silicon via Semiconductor device fabrication Microtechnology Electronics
887	Enabling a fabless MEMS industry by improving the MEMS development process GSA MEMS Working Group Meeting Alissa M. Fitzgerald, Ph.D. \| 12 December 2012 Overview Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:35 Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Electromagnetism Engineering Fabless semiconductor company Gyroscope Accelerometer Semiconductor device fabrication Microtechnology Technology
888	Calibre 3DSTACK John Ferguson Marketing Director – DRC Applications Stacking Chips Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-07-24 00:36:02 Semiconductor device fabrication Three-dimensional integrated circuit Physical verification Mentor Graphics Electronic design automation Electronic engineering Electronics Integrated circuits
889	Supply Chain Development for 3D ASIC and Memory Integration Li Li Cisco Systems, Inc. Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:53:26 Computer memory SDRAM Semiconductor device fabrication Computer hardware Three-dimensional integrated circuit Dynamic random-access memory Application-specific integrated circuit Random-access memory 3DS Electronics Integrated circuits Electronic engineering
890	Thermal Analysis for 3D Integration GSA OctGene Matter, VP Application Engineering, DOCEA POWER © DOCEA Power - Confidential Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:09 Electromagnetism Semiconductor device fabrication Three-dimensional integrated circuit Ball grid array Flip chip Network On Chip Electronics manufacturing Electronic engineering Electronics Integrated circuits

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